US 12,093,476 B2
Touch sensor and method for making the same
Biao Deng, Suzhou (CN); Jie Ma, Suzhou (CN); Bei Lei, Suzhou (CN); Kai Jiang, Suzhou (CN); and Hak Fei Poon, Suzhou (CN)
Assigned to NUOVO FILM SUZHOU CHINA INC., Suzhou (CN)
Appl. No. 17/609,399
Filed by NUOVO FILM SUZHOU CHINA INC., Suzhou (CN)
PCT Filed Nov. 22, 2019, PCT No. PCT/CN2019/120161
§ 371(c)(1), (2) Date Nov. 7, 2021,
PCT Pub. No. WO2020/233040, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 201910409860.3 (CN), filed on May 17, 2019.
Prior Publication US 2022/0221949 A1, Jul. 14, 2022
Int. Cl. G06F 3/041 (2006.01); H05K 3/20 (2006.01)
CPC G06F 3/041 (2013.01) [G06F 3/04164 (2019.05); H05K 3/20 (2013.01); G06F 2203/04103 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for making a touch sensor, the method comprising steps of:
forming an electrode layer in a window area of a substrate;
arranging a frame trace in a frame trace area of the substrate located on a periphery of the window area for electrical connection with the electrode layer, wherein the frame trace comprises a plurality of metal wires, and each metal wire comprises a metal wire body and an insulation layer wrapped around an outer periphery of the metal wire body; and
removing the insulation layer of a lapping portion of the metal wire, and electrically connecting the lapping portion to a corresponding electrode in the electrode layer;
wherein the arranging the frame trace comprises:
forming a conductive silver paste electrically connected to the electrode in the frame trace area and an adhesive layer on the conductive silver paste; and
arranging the metal wire on the adhesive layer; or
the step of arranging the frame trace comprises:
forming a conductive silver paste electrically connected to the electrode in the frame trace area;
forming an opening in an adhesive layer;
arranging metal wires at a position of the adhesive layer corresponding to the frame trace area, wherein at least part of the structure of the lapping portion is located in the opening; and
assembling the adhesive layer with metal wires onto the substrate;
the opening corresponds to the conductive silver paste.