US 12,093,092 B2
Heat transfer apparatus for a computer environment
Devdatta P. Kulkarni, Olympia, WA (US); and Timothy G. Hanna, Olympia, WA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jan. 4, 2022, as Appl. No. 17/568,615.
Application 17/568,615 is a continuation of application No. 15/199,003, filed on Jun. 30, 2016, granted, now 11,249,522.
Prior Publication US 2022/0137685 A1, May 5, 2022
Int. Cl. G06F 1/20 (2006.01); F25B 21/02 (2006.01)
CPC G06F 1/20 (2013.01) [F25B 21/02 (2013.01); G06F 1/206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first thermoelectric cooler (TEC) to remove heat from a first component of one or more components of the electronic device, wherein the first TEC is variably controllable based on a change to an amount of energy provided to the first TEC, and wherein the first TEC is activated based on an identification that a level of operation of the first component exceeds a threshold level of operation of the first component;
a second TEC to remove heat from a second component of the one or more components, wherein the second TEC is variably controllable based on a change to an amount of energy provided to the second TEC, and wherein the second TEC is activated based on an identification that a level of operation of the second component exceeds a threshold level of operation of the second component; and
a liquid coolant system coupled with the first TEC, wherein the liquid coolant system is to remove heat from the first TEC;
wherein the change to the amount of energy provided to the first TEC is dynamic and is controllable individually of the change to the amount of energy provided to the second TEC.