US 12,092,966 B2
Device feature specific edge placement error (EPE)
Amnon Manassen, Haifa (IL); Nadav Gutman, Zichron Ya'aqov (IL); Frank Laske, Weilburg (DE); and Andrei V. Shchegrov, Campbell, CA (US)
Assigned to KLA Corporation, Milpitas, CA (US)
Filed by KLA Corporation, Milpitas, CA (US)
Filed on Nov. 3, 2023, as Appl. No. 18/386,846.
Claims priority of provisional application 63/427,518, filed on Nov. 23, 2022.
Prior Publication US 2024/0168391 A1, May 23, 2024
Int. Cl. G01B 15/00 (2006.01); G01B 11/27 (2006.01); G03F 7/00 (2006.01)
CPC G03F 7/706845 (2023.05) [G01B 11/272 (2013.01); G01B 15/00 (2013.01); G03F 7/70655 (2023.05); G01B 2210/56 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A metrology system comprising:
a first metrology sub-system configured to have a first resolution;
a second metrology sub-system configured to have a second resolution that is lower than the first resolution; and
one or more controllers communicatively coupled to the first metrology sub-system and the second metrology sub-system and comprising one or more processors configured to execute program instructions configured to:
perform a training comprising:
receiving first metrology data for a plurality of device features from the first metrology sub-system;
generating first metrology measurements of the device features based on the first metrology data;
binning the device features into two or more device bins based on the first metrology measurements; and
identifying representative metrology targets for the two or more device bins based on distributions of the first metrology measurements, wherein each of the representative metrology targets is selected to provide that second metrology measurements based on second metrology data from the second metrology sub-system for the representative metrology targets are representative of the first metrology measurements of the device features in the corresponding two or more device bins; and
perform a run-time operation comprising:
receiving run-time metrology data of the representative metrology targets on one or more run-time samples from the second metrology sub-system; and
generating run-time metrology measurements of the representative metrology targets on the one or more run-time samples based on the run-time metrology data.