US 12,092,956 B2
Nanoimprint and etch fabrication of optical devices
Jing Jiang, Santa Clara, CA (US); Chien-An Chen, San Jose, CA (US); and Rutger Meyer Timmerman Thijssen, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 24, 2022, as Appl. No. 17/703,315.
Claims priority of provisional application 63/174,374, filed on Apr. 13, 2021.
Prior Publication US 2022/0326611 A1, Oct. 13, 2022
Int. Cl. G03F 7/00 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01)
CPC G03F 7/0005 (2013.01) [G03F 7/2043 (2013.01); G03F 7/162 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method, comprising:
depositing a first resist layer on a substrate, the substrate having a hardmask disposed over a device material, the device material is disposed under an entire area of the hardmask;
imprinting a first resist portion of the first resist layer with a first single-height stamp having first duty cycle to corresponding to a first duty cycle of first optical device structures of an optical device to be formed;
etching the first resist portion of the first resist layer;
etching a first hardmask portion of the hardmask corresponding to the first resist portion of the first resist layer;
removing the first resist layer and depositing a second resist layer;
imprinting a second resist portion of the second resist layer with a second single-height stamp having a second duty cycle to corresponding to a second duty cycle of second optical device structures of the optical device to be formed;
etching the second resist portion of the second resist layer;
etching a second hardmask portion of the hardmask corresponding to the second resist portion of the second resist layer; and
etching the device material to form an optical device with a first portion of having the first optical device structures with the first duty cycle, the second optical device structures with the second duty cycle different that the first duty cycle, and an intermediate portion between the first portion and the second portion.