CPC G03F 7/0002 (2013.01) [B25B 11/005 (2013.01); G01M 3/26 (2013.01)] | 7 Claims |
1. A holding device used in a lithography apparatus for transferring a pattern formed on a mold to a substrate, for attracting and holding the mold or the substrate by a reduced pressure, the holding device comprising:
a holding unit configured to hold one of the mold or the substrate, and including a plurality of concave portions forming a plurality of spaces together with the mold or the substrate;
a first pressure mechanism including a vacuum pump configured to depressurize at least one first space among the plurality of spaces formed by the mold or the substrate and the holding unit;
a second pressure mechanism including a pressurizing pump configured to pressurize at least one second space among the plurality of spaces to a pressure different from that of the first space;
a controller configured to control the first and second pressure mechanisms so that the first and second spaces are adjacent to each other; and
a flow rate sensor configured to measure a flow rate of each of the first and second pressure mechanisms,
wherein the controller is configured to determine an abnormality related to attracting and holding of the mold or the substrate between the first space and the second space based on each of the measured flow rates, the abnormality including:
an increase in a gas flow rate between the first space and the second space due to a foreign substance sandwiched between the mold or the substrate and a holding surface of the holding unit between the first space and the second space; or
wear of the holding surface between the first space and the second space.
|