US 12,092,881 B2
Optical module
Yuzhou Sun, Suzhou (CN); Long Chen, Suzhou (CN); Dengqun Yu, Suzhou (CN); and Weilong Lee, Suzhou (CN)
Assigned to InnoLight Technology PTE. LTD., Singapore (SG)
Filed by InnoLight Technology PTE. LTD., Singapore (SG)
Filed on Dec. 21, 2022, as Appl. No. 18/069,285.
Application 18/069,285 is a continuation of application No. 16/685,119, filed on Nov. 15, 2019, granted, now 11,561,351.
Application 16/685,119 is a continuation of application No. 16/024,963, filed on Jul. 2, 2018, granted, now 10,495,832, issued on Dec. 3, 2019.
Claims priority of application No. 201710591788.1 (CN), filed on Jul. 19, 2017.
Prior Publication US 2023/0117778 A1, Apr. 20, 2023
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4256 (2013.01) [G02B 6/4269 (2013.01); G02B 6/428 (2013.01); G02B 6/421 (2013.01); G02B 6/4246 (2013.01); G02B 6/4284 (2013.01); G02B 6/4292 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a housing;
a heat sink disposed in the housing and thermally connected to the housing; and
a printed circuit board (PCB) partially fixed to the heat sink,
wherein the optical module further comprises an optoelectronic chip electrically connected to the PCB and disposed on the heat sink, and
the PCB is a rigid printed circuit board,
the heat sink includes a first connecting surface,
the PCB includes a second connecting surface parallel to the first connecting surface of the heat sink,
the second connecting surface of the PCB is directly connected to the first connecting surface of the heat sink, and
a portion of the heat sink overlapped by the optoelectronic chip is not overlapped with the PCB.