| CPC G02B 6/30 (2013.01) [G02B 6/12 (2013.01); G02B 6/4214 (2013.01); G02B 6/4268 (2013.01); G02B 6/4269 (2013.01)] | 15 Claims |
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1. A silicon photonic package, comprising an optical waveguide structure, a heat dissipation structure, a plastic encapsulation layer, a first structure, a second structure and a photonic chip,
the optical waveguide structure implemented as a right trapezoidal structure having opposing front and back faces, a longitudinal cross-section of the optical waveguide structure comprises opposing first and second bases and opposing first and second legs, the first base disposed on the front face of the optical waveguide structure, the second base disposed on the back face of the optical waveguide structure, the first base having a length greater than a length of the second base, wherein an angle formed between the first base and the first leg is 90°, an angle formed between the first base and the second leg is around 45°, the optical waveguide structure is connected to an optical fiber in a plane where the first leg is disposed, the second leg is disposed on a totally reflecting surface capable of totally reflecting an optical signal that enters the optical waveguide structure from a surface where the first leg is disposed in a direction parallel to the front face to a plane where the first base is disposed,
the heat dissipation structure spaced apart from the optical waveguide structure and embedded together therewith in the plastic encapsulation layer, the heat dissipation structure having opposing front and back faces, the second leg disposed between the heat dissipation structure and the first leg;
the plastic encapsulation layer having opposing front and back faces and opposing first and second side faces, the front faces of the optical waveguide structure, the heat dissipation structure and the plastic encapsulation layer disposed on the same side, the first side face of the plastic encapsulation layer disposed parallel to the plane where the first leg is disposed, the first leg disposed between the first side face and the second leg, the front faces of the optical waveguide structure and the heat dissipation structure exposed from the front face of the plastic encapsulation layer, the back face of the heat dissipation structure exposed from the back face of the plastic encapsulation layer, the back face of the optical waveguide structure disposed between the front and back faces of the plastic encapsulation layer, the plastic encapsulation layer provided therein with multiple through holes extending through the plastic encapsulation layer along its thickness direction, the multiple through holes filled therein with a conductive material,
the first structure disposed on the front face of the plastic encapsulation layer, the first structure electrically connected on the side of the front face of the plastic encapsulation layer to the conductive material in the through holes and to the heat dissipation structure,
the second structure disposed on the back face of the plastic encapsulation layer, the second structure electrically connected on the side of the back face of the plastic encapsulation layer to the conductive material in the through holes and to the heat dissipation structure,
the photonic chip disposed on the first structure such as to be electrically connected to the first structure and optically connected to the front face of the optical waveguide structure.
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