| CPC G02B 6/1225 (2013.01) [G02B 6/12004 (2013.01); G02B 6/12007 (2013.01); G02B 6/13 (2013.01); G02B 6/136 (2013.01); H01L 21/0275 (2013.01); H04J 14/02 (2013.01)] | 8 Claims |
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1. A method for controlling a semiconductor photonic substrate, comprising:
using a controller to program, at a first time, a plurality of photonic modules lithographically patterned on the semiconductor photonic substrate to form a first optical communication path coupling together a first subset of a plurality of electronic dies, wherein the plurality of electronic dies are configured to be connected to respective photonic modules of the plurality of photonic modules, wherein each photonic module comprises:
an electrical connection configured to electrically couple the photonic module to electronic circuitry formed on the respective electronic die when the respective electronic die is bonded to the semiconductor photonic substrate;
an optical distribution network configured to selectively route signals among the plurality of electronic dies when the electronic dies are bonded to the semiconductor photonic substrate;
a waveguide optically coupling the optical distribution network to a waveguide of a neighboring photonic module that is adjacent to the photonic module; and
a plurality of transistors, wherein the waveguide and the plurality of transistors are embedded in a common material layer; and
using the controller to reprogram, at a second time subsequent the first time, the plurality of photonic modules to form a second optical communication path coupling together a second subset of the plurality of electronic dies.
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