US 12,092,866 B2
Photonic communication platform
Nicholas C. Harris, Boston, MA (US); Carl Ramey, Westborough, MA (US); Michael Gould, La Honda, CA (US); Thomas Graham, Cambridge, MA (US); Darius Bunandar, Boston, MA (US); Ryan Braid, Cambridge, MA (US); and Mykhailo Tymchenko, Melrose, MA (US)
Assigned to Lightmatter, Inc., Boston, MA (US)
Filed by Lightmatter, Inc., Boston, MA (US)
Filed on Aug. 24, 2023, as Appl. No. 18/455,395.
Application 17/313,415 is a division of application No. 16/810,573, filed on Mar. 5, 2020, granted, now 11,036,002, issued on Jun. 15, 2021.
Application 18/455,395 is a continuation of application No. 18/356,680, filed on Jul. 21, 2023.
Application 18/356,680 is a continuation of application No. 17/313,415, filed on May 6, 2021, granted, now 11,754,783.
Claims priority of provisional application 62/961,448, filed on Jan. 15, 2020.
Claims priority of provisional application 62/923,889, filed on Oct. 21, 2019.
Claims priority of provisional application 62/814,444, filed on Mar. 6, 2019.
Prior Publication US 2023/0400632 A1, Dec. 14, 2023
Int. Cl. G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/13 (2006.01); G02B 6/136 (2006.01); H01L 21/027 (2006.01); H04J 14/02 (2006.01)
CPC G02B 6/1225 (2013.01) [G02B 6/12004 (2013.01); G02B 6/12007 (2013.01); G02B 6/13 (2013.01); G02B 6/136 (2013.01); H01L 21/0275 (2013.01); H04J 14/02 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for fabricating a photonic system, comprising:
using a stepper machine to lithographically pattern a semiconductor wafer with a plurality of photonic modules, wherein patterning the semiconductor wafer comprises:
patterning the semiconductor wafer with a first photonic module using at least a first photomask; and
subsequent to patterning the semiconductor wafer with the first photonic module, patterning the semiconductor wafer with a second photonic module using at least the first photomask;
wherein each of the first and second photonic modules, when patterned, comprises:
first and second boundaries;
an optical distribution network;
a first optical waveguide optically coupling the optical distribution network to a first neighboring photonic module of the plurality of photonic modules, the first neighboring photonic module being adjacent to the first boundary; and
a second optical waveguide optically coupling the optical distribution network to a second neighboring photonic module of the plurality of photonic modules, the second neighboring photonic module being adjacent to the second boundary.