US 12,092,656 B2
Test apparatus and test method thereof
Sungyoon Ryu, Seoul (KR); Seungbum Hong, Daejeon (KR); Kwangeun Kim, Suwon-si (KR); Hoon Kim, Daejeon (KR); Jiwon Yeom, Nonsan-si (KR); Seokjung Yun, Iksan-si (KR); Souk Kim, Seoul (KR); Younghoon Sohn, Seoul (KR); and Yusin Yang, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 15, 2022, as Appl. No. 17/721,522.
Claims priority of application No. 10-2021-0078050 (KR), filed on Jun. 16, 2021.
Prior Publication US 2022/0404395 A1, Dec. 22, 2022
Int. Cl. G01R 1/067 (2006.01); G01N 29/06 (2006.01); G01R 1/04 (2006.01); G01R 1/073 (2006.01)
CPC G01R 1/06727 (2013.01) [G01R 1/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A test apparatus, comprising:
a sample stage to support a sample, the sample stage being movable to adjust a position of the sample in a direction parallel to an upper surface of the sample stage;
a plurality of tips above the sample stage, the plurality of tips having different shapes, and the plurality of tips being configured to alternately perform profiling and milling on the sample supported on the sample stage;
a tip stage connected to a cantilever, the cantilever being coupled to at least one of the plurality of tips, and the tip stage being configured to adjust a position of the cantilever in a first direction perpendicular to the upper surface of the sample stage to alternately perform profiling and milling on the sample supported on the sample stage;
a position sensor configured to obtain information about a positional relationship between the at least one of the plurality of tips and the sample;
a stage controller configured to control movements of the sample stage and the tip stage, based on the information about the positional relationship; and
a tip controller configured to select the at least one of the plurality of tips for alternately performing the profiling and the milling on the sample supported on the sample stage and to determine conditions for performing the milling on the sample supported on the sample stage,
wherein a depth of the sample being processed by the milling in the first direction is controlled based on a relationship between a distance between the at least one of the plurality of tips and the sample and a force between the at least one of the plurality of tips and the sample.