US 12,092,655 B2
Testing devices and method for testing semiconductor devices
Wu-Der Yang, Taoyuan (TW)
Assigned to NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed by NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed on May 12, 2022, as Appl. No. 17/742,546.
Prior Publication US 2023/0366910 A1, Nov. 16, 2023
Int. Cl. G01R 1/04 (2006.01); G01R 31/28 (2006.01); H01R 12/85 (2011.01)
CPC G01R 1/0466 (2013.01) [G01R 1/0458 (2013.01); G01R 31/2886 (2013.01); G01R 31/2896 (2013.01); H01R 12/85 (2013.01); G01R 31/2863 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A testing device, comprising:
a socket having a cavity for accommodating a device under test (DUT), wherein the socket is made of a thermal conductive material;
a cover disposed on a top surface of the socket, the cover comprising:
a plate;
a circuit board attached to a bottom side of the plate, wherein a size of the circuit board is larger than a size of the cavity of the socket; and
an opening penetrating the plate and the circuit board for exposing the cavity of the socket.