US 12,092,540 B2
Package structure for differential pressure sensor, and electronic device
Gang Li, Suzhou (CN); Jiaxin Mei, Suzhou (CN); and Chenglong Shao, Suzhou (CN)
Assigned to MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO. LTD., Jiangsu (CN)
Filed by MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO. LTD., Suzhou (CN)
Filed on Oct. 11, 2021, as Appl. No. 17/498,546.
Application 17/498,546 is a continuation of application No. PCT/CN2019/112935, filed on Oct. 24, 2019.
Claims priority of application No. 201910280377.X (CN), filed on Apr. 9, 2019.
Prior Publication US 2022/0026299 A1, Jan. 27, 2022
Int. Cl. G01L 13/06 (2006.01); G01L 19/06 (2006.01)
CPC G01L 13/06 (2013.01) [G01L 19/0654 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a package structure for a differential pressure sensor, wherein the package structure further comprises:
a substrate and a housing, wherein an edge of the housing is fixed to a front side of the substrate, and a first chamber is defined between the housing and the substrate; and
a pressure sensor fixed to the front side of the substrate and disposed in the first chamber, wherein the pressure sensor comprises a second chamber and a pressure sensing layer, and the pressure sensing layer is disposed between the first chamber and the second chamber;
wherein the first chamber is connected with outside via a first through hole, and the second chamber is connected with the outside via a second through hole; and
a first circuit board, wherein the first circuit board comprises a third through hole, and the third through hole is connected with the second through hole.