CPC G01K 1/20 (2013.01) [G01K 1/026 (2013.01); G01K 7/00 (2013.01); G01K 1/08 (2013.01); G01K 1/14 (2013.01); G01K 13/02 (2013.01); G01K 2215/00 (2013.01); G12B 15/06 (2013.01)] | 29 Claims |
1. A sensor system, comprising:
a first temperature sensor configured to generate a first sensing signal representing a first temperature of a first system component at a first location, the first temperature sensor including a temperature sensing element within a probe tip configured to engage with the first system component at the first location;
a power source configured to convert thermal energy received from the first location to electrical energy;
sensor circuitry configured to generate sensor data based on the first sensing signal using the electrical energy from the power source, the sensor circuitry being characterized by a thermal rating;
one or more heat dissipation components;
a first mounting component; and
one or more thermal isolation components configured to thermally isolate the probe tip from the power source and from the first mounting component;
wherein at least the first temperature sensor, the power source, the sensor circuitry, the one or more heat dissipation components, and the first mounting component are combined in a first integrated assembly configured for mounting on the first system component at the first location using the first mounting component, and wherein the first integrated assembly is constructed such that a second temperature of the sensor circuitry remains within the thermal rating over an expected range of the first temperature.
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