CPC G01H 3/125 (2013.01) [H04R 1/406 (2013.01); H04R 3/005 (2013.01); H04R 19/04 (2013.01); G11C 7/1096 (2013.01); H04R 2201/003 (2013.01); H04R 2201/401 (2013.01)] | 18 Claims |
1. A sensor system comprising:
a flexible support substrate configured to be conformally mounted to curved surfaces;
an array of digital sensor devices carried by the flexible support substrate, each of the digital sensor devices configured to generate a respective digital output signal that conveys raw digital sensor output data, wherein:
the array of digital sensor devices comprises a lower wavenumber array comprising a first set of the digital sensor devices and a higher wavenumber array comprising a second set of the digital sensor devices;
the higher wavenumber array comprises a plurality of sub-arrays comprising respective subsets of the second set of the digital sensor devices;
the first set of the digital sensor devices of the lower wavenumber array are uniformly distributed across the flexible support substrate; and
sub-arrays of the plurality of sub-arrays are nonuniformly interspersed amongst the first set of the digital sensor devices of the lower wavenumber array;
an array of random-access memory (RAM) devices carried by the flexible support substrate, the RAM devices directly connected to the digital sensor devices during a data recording operation of the sensor system, such that the RAM devices directly receive the digital output signals; and
a controller operatively coupled to the array of RAM devices to synchronously clock the array of RAM devices during the data recording operation, such that the raw digital sensor output data is synchronously written to the array of RAM devices.
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