US 12,092,460 B2
Silicon MEMS gyroscopes with upper and lower sense plates
Eugene H. Cook, Acton, MA (US); Jonathan J. Bernstein, Medfield, MA (US); Mirela G. Bancu, Melrose, MA (US); Marc Steven Weinberg, Dedham, MA (US); and William Sawyer, Littleton, MA (US)
Assigned to The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US)
Filed by The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US)
Filed on Nov. 3, 2022, as Appl. No. 17/980,045.
Application 17/980,045 is a division of application No. 16/580,618, filed on Sep. 24, 2019, granted, now 11,530,917.
Claims priority of provisional application 62/735,512, filed on Sep. 24, 2018.
Prior Publication US 2023/0076161 A1, Mar. 9, 2023
Int. Cl. G01C 19/5621 (2012.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01C 19/5628 (2012.01)
CPC G01C 19/5621 (2013.01) [B81B 3/0097 (2013.01); B81C 1/00166 (2013.01); G01C 19/5628 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/04 (2013.01); B81B 2207/096 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0133 (2013.01); B81C 2203/035 (2013.01); B81C 2203/036 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A tuning fork gyroscope sensor, comprising:
a silicon sense plate wafer including a silicon handle layer including vias for electrical connections, wherein the silicon sense plate wafer is a silicon on insulator (SOI) wafer;
a silicon proof mass wafer, including a proof mass, bonded to the silicon sense plate wafer; and
a sealing ring around the proof mass.