US 12,091,636 B2
Composition for dissolving abrasive particles and cleaning method using the same
Kyong Jin Jung, Gyeonggi-do (KR); Ga Young Jung, Gyeonggi-do (KR); Young Ho Yun, Anseong-si (KR); Kun Hee Park, Gyeonggi-do (KR); Young Gon Kim, Anseong-si (KR); and Yong Ho Jeong, Gyeonggi-do (KR)
Assigned to KCTECH CO., LTD., Gyeonggi-do (KR)
Filed by KCTECH CO., LTD., Anseong-si (KR)
Filed on Nov. 1, 2021, as Appl. No. 17/516,668.
Claims priority of application No. 10-2020-0147813 (KR), filed on Nov. 6, 2020.
Prior Publication US 2022/0145216 A1, May 12, 2022
Int. Cl. C11D 1/00 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); C11D 1/14 (2006.01); H01L 21/304 (2006.01)
CPC C11D 1/143 (2013.01) [C09G 1/02 (2013.01); C09K 3/1409 (2013.01); C11D 1/004 (2013.01); C11D 2111/22 (2024.01); H01L 21/304 (2013.01)] 11 Claims
 
1. A composition for dissolving abrasive particles, the composition comprising:
a sulfur-containing organic acid;
a fluorine ion-containing compound;
a solvent; and
a sulfur-containing compound,
wherein a turbidity change rate (%) measured at 60° C. for 15 minutes is in a range of −80 to −99,
wherein the sulfur-containing organic acid comprises at least one selected from a group consisting of sulfenic acid (RSOH), sulfinic acid (RSO(OH)), organic sulfonic acid (RS(═O)2—OH), thiosulfonic acid (RSO2SH), and thiocarboxylic acid (RC(S)OH), and
wherein the sulfur-containing compound comprises at least one selected from a group consisting of thiosulfuric acid (H2S2O3), sulfuric acid, sulfide, bisulfide (R—S—S—R′), hydrogen sulfide (H2S), sulfur trioxide (SO3), sulfamic acid, mercaptan (R—SH), and sulfonate, and
wherein the sulfur-containing compound is included in an amount of 5 wt % to 15 wt % in the composition, and
wherein a mass ratio of the sulfur-containing compound:the sulfur-containing organic acid is in a range of 2:1 to 5:1, and
wherein the composition is used to dissolve abrasive particles remaining after polishing using a chemical mechanical polishing (CMP) slurry containing abrasive particles.