US 12,091,311 B2
Wafer level packaging of MEMS
Stuart M. Jacobsen, Frisco, TX (US); and Wei-Yan Shih, Plano, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Mar. 20, 2017, as Appl. No. 15/463,246.
Application 15/463,246 is a division of application No. 14/467,616, filed on Aug. 25, 2014, granted, now 9,630,835.
Prior Publication US 2017/0217759 A1, Aug. 3, 2017
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/0051 (2013.01) [B81C 1/00333 (2013.01); B81C 1/00349 (2013.01); B81C 1/00396 (2013.01); B81C 1/00523 (2013.01); B81C 1/00666 (2013.01); B81B 2207/07 (2013.01); B81B 2207/097 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A microelectronic mechanical systems (MEMS) device, comprising:
a substrate;
a component disposed on the substrate;
a headspace wall disposed on the substrate, surrounding the component, the headspace wall comprising a polymer material;
a headspace cap disposed on the headspace wall, the headspace cap comprising a dry film polymer material, the headspace wall and the headspace cap isolating the component in a headspace; and
a fin of the polymer material, the fin being disposed inside the headspace wall and contiguous with the headspace wall.