US 12,090,693 B2
Co-injection molding apparatus, method for controlling same, and injection product by co-injection molding
Eunsu Jo, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Filed by LG ELECTRONICS INC., Seoul (KR)
Filed on Aug. 23, 2021, as Appl. No. 17/408,957.
Claims priority of application No. 10-2020-0111350 (KR), filed on Sep. 1, 2020.
Prior Publication US 2022/0063157 A1, Mar. 3, 2022
Int. Cl. B29C 45/22 (2006.01); B29C 45/17 (2006.01); B29C 45/18 (2006.01)
CPC B29C 45/22 (2013.01) [B29C 45/1704 (2013.01); B29C 45/1866 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A co-injection molding apparatus to mold an injection product that includes a skin layer to form an outer surface and a core layer having an interior to be surrounded by the skin layer, the skin layer to be formed by a first material, and the core layer to be formed by a second material, the co-injection molding apparatus comprising:
an injection mold configured to be injection molded by the first material and the second material, and to provide the injection product;
a runner configured to provide the first material and the second material to the injection mold;
a first injector configured to inject the first material to the runner;
a second injector configured to inject the second material, different from the first material, to the runner and the second injector provided between the first injector and the injection mold,
wherein the runner includes:
a runner main body configured to connect to the first injector and to the second injector,
a bypass runner configured to connect the second injector and the injection mold, and including at least one bend so as to increase a retention amount of the first material, and
a backflow prevention part formed on the runner main body between the first injector and the second injector, and having a diameter smaller than a diameter of the runner main body.