US 12,090,685 B2
Ingot temperature controller and wire sawing device having same
Young Il Jin, Seoul (KR)
Assigned to SK SILTRON CO., LTD., Gyeongsangbuk-do (KR)
Appl. No. 17/780,162
Filed by SK Siltron Co., LTD., Gyeongsangbuk-do (KR)
PCT Filed May 8, 2020, PCT No. PCT/KR2020/006073
§ 371(c)(1), (2) Date May 26, 2022,
PCT Pub. No. WO2021/153846, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 10-2020-0010913 (KR), filed on Jan. 30, 2020.
Prior Publication US 2022/0410432 A1, Dec. 29, 2022
Int. Cl. C30B 15/20 (2006.01); B28D 5/04 (2006.01); C30B 15/14 (2006.01)
CPC B28D 5/045 (2013.01) [C30B 15/14 (2013.01); C30B 15/20 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A wire sawing apparatus comprising:
a chamber;
an ingot clamp configured to support an ingot in the chamber;
a first roller and a second roller;
a wire wound around the first roller and the second roller, the wire being configured to cut the ingot into a plurality of wafers while being rotated;
a slurry supply nozzle disposed above the first roller and the second roller to supply a slurry solution to the wire;
a heat exchanger configured to adjust a temperature of the slurry that moves to the slurry supply nozzle in real time; and
an ingot temperature controller comprising:
a temperature measurement unit mounted in the chamber in which the ingot is cut, the temperature measurement unit being configured to measure a temperature of the ingot; and
a heater unit mounted in the chamber.