US 12,090,642 B2
Die pickup module and die bonding apparatus including the same
Chang Bu Jeong, Gyeonggi-do (KR); Jong Sung Park, Gyeonggi-do (KR); Jung Sub Kim, Chungcheongnam-do (KR); Young Gun Park, Chungcheongnam-do (KR); Dae Seok Choi, Chungcheongnam-do (KR); Sang Hoon Jung, Chungcheongnam-do (KR); Min Gu Lee, Chungcheongnam-ro (KR); Eui Sun Choi, Seoul (KR); Kang San Lee, Gyeonggi-do (KR); Dae Ho Min, Seoul (KR); and Seung Dae Seok, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR); and SAMSUNG ELECTRONICS CO., LTD, Gyeonggi-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR); and SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do (KR)
Filed on Aug. 25, 2020, as Appl. No. 17/002,008.
Claims priority of application No. 10-2019-0105301 (KR), filed on Aug. 27, 2019.
Prior Publication US 2021/0060798 A1, Mar. 4, 2021
Int. Cl. B25J 15/06 (2006.01); B65G 47/91 (2006.01)
CPC B25J 15/0616 (2013.01) [B65G 47/911 (2013.01); B65G 2249/045 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A die pickup module comprising:
a wafer stage for supporting a wafer including dies attached on a dicing tape;
a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape;
a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die;
a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die; and
an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker, the non-contact picker maintaining the die in the non-contact manner so as not to contact the front surface of the die when inverted by the inverting driving unit.