US D1,093,313 S
Coil for substrate mounting
Hideto Saeki, Shanghai (CN); Junji Kondo, Shanghai (CN); Jinwei Lin, Shanghai (CN); Xiaoming Yang, Shanghai (CN); and Jian Wang, Shanghai (CN)
Assigned to TAMURA CORPORATION, Tokyo (JP); and TAMURA CORPORATION OF CHINA LIMITED, Shanghai (CN)
Filed by TAMURA CORPORATION, Tokyo (JP); and TAMURA CORPORATION OF CHINA LIMITED, Shanghai (CN)
Filed on Sep. 15, 2022, as Appl. No. 29/853,493.
Claims priority of application No. 2022-016463 D (JP), filed on Aug. 2, 2022.
Term of patent 15 Years
LOC (15) Cl. 13 - 02
U.S. Cl. D13—117
OG exemplary drawing
 
The ornamental design for a coil for substrate mounting as shown.