US 12,419,118 B2
Cell module
Chiou-Chu Lai, Zhubei (TW); Chun-Wei Su, Zhubei (TW); Yi-Chun Liu, Zhudong Township (TW); Hsin-Hsin Hsieh, Taipei (TW); Hsin-Chung Wu, Sihu Township (TW); En-Yu Pan, Zhubei (TW); and Chin-Ping Huang, Hsinchu (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Nov. 30, 2023, as Appl. No. 18/525,139.
Claims priority of application No. 112108139 (TW), filed on Mar. 6, 2023.
Prior Publication US 2024/0304741 A1, Sep. 12, 2024
Int. Cl. H10F 19/80 (2025.01)
CPC H10F 19/804 (2025.01) 8 Claims
OG exemplary drawing
 
1. A cell module, comprising:
a first substrate;
a second substrate disposed opposite to the first substrate;
a cell unit disposed between the first substrate and the second substrate;
a first thermosetting resin layer disposed between the cell unit and the first substrate;
a first protective layer disposed between the cell unit and the first thermosetting resin layer, wherein the first protective layer comprises a first polymer, and a cross-linking degree of the first polymer is 22.2% to 42.3%; and
a second thermosetting resin layer disposed between the cell unit and the second substrate.