| CPC H10F 19/30 (2025.01) [H10F 71/00 (2025.01); H10F 77/227 (2025.01)] | 30 Claims |

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1. A hybrid photovoltaic (PV) device, comprising:
(a) a rigid PV segment, comprising a first set of one or more PV cells that convert incoming light to electricity, wherein the rigid PV segment is non-foldable and non-bendable;
(b) a co-located flexible PV segment, comprising a second set of one or more PV cells that convert incoming light to electricity, wherein the flexible PV segment is foldable or bendable, wherein folding or bending of the flexible PV segment does not significantly damage the flexible PV segment;
wherein each PV cell of said flexible PV segment is, by itself, a flexible PV cell having enhanced properties of mechanical impact absorption and mechanical resilience to forces, and comprises:
a semiconductor wafer
having a thickness, and having a first surface, and a having second surface that is opposite to said first surface;
a set of non-transcending gaps, within said semiconductor wafer,
wherein each non-transcending gap penetrates from the first surface of said semiconductor wafer towards the second surface of said semiconductor wafer but reaches to a depth of between 50 to 99 percent of the thickness of the semiconductor wafer, and does not reach said second surface;
wherein each non-transcending gap does not entirely penetrate through an entirety of the thickness of said semiconductor wafer,
wherein said semiconductor wafer maintains between 1 to 50 percent of the thickness of the semiconductor wafer as an intact and non-penetrated thin layer of semiconductor wafer that remains intact and non-penetrated by said non-transcending gaps,
wherein each non-transcending gap is filled with an elastomer that absorbs mechanical shocks and dissipates mechanical forces that are applied towards each said PV cell of said flexible PV segment;
wherein the non-transcending gaps in the semiconductor wafer, and the elastomer that fills the non-transcending gaps in the semiconductor wafer, absorb and dissipate mechanical forces and provide flexibility to said flexible PV cell;
(c) one or more electric connectors, that connect between (i) electric current or electric voltage that are generated by the rigid PV segment, and (ii) electric current or electric voltage that are generated by the flexible PV segment;
(d) a unified encapsulation layer, which encapsulates together both the rigid PV segment and the co-located flexible PV segment;
wherein the rigid PV segment, the co-located flexible PV segment, the one or more electric connectors, and the unified encapsulation layer, form together said hybrid PV device which is a single stand-alone PV device that converts incoming light to electricity and that has at least one rigid region corresponding to said rigid PV segment and at least one flexible region corresponding to said co-located flexible PV segment.
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