| CPC H10D 87/00 (2025.01) [H10D 86/0221 (2025.01); H10D 86/423 (2025.01); H10D 86/60 (2025.01)] | 20 Claims |

|
14. A semiconductor device, comprising:
a substrate comprising a semiconductor material layer;
a plurality of device structures formed on or in the semiconductor material layer;
at least one interconnect-level dielectric layer over the substrate and the plurality of device structures and comprising conductive interconnect structures; and
a NOT gate logic circuit located over an interconnect-level dielectric layer, the NOT gate logic circuit comprising:
a first conductivity-type semiconductor layer;
a second conductivity-type semiconductor layer;
a first electrode contacting a first side surface of the first conductivity-type semiconductor layer;
a second electrode contacting a first side surface of the second conductivity-type semiconductor layer;
a dielectric isolation layer extending between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer and between the first electrode and the second electrode;
a third electrode contacting a second side surface of the first conductivity-type semiconductor layer, a second side surface of the second conductivity-type semiconductor layer, and a side surface of the dielectric isolation layer;
a gate dielectric layer contacting the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; and
a gate electrode contacting the gate dielectric layer.
|