| CPC H10D 64/017 (2025.01) [H10D 30/014 (2025.01); H10D 30/43 (2025.01); H10D 30/6219 (2025.01); H10D 30/6713 (2025.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 64/018 (2025.01); H10D 64/251 (2025.01); H10D 64/258 (2025.01); H01L 21/02532 (2013.01); H01L 21/02535 (2013.01); H01L 21/02543 (2013.01); H01L 21/02546 (2013.01); H01L 21/02565 (2013.01); H01L 21/02603 (2013.01); H10D 30/021 (2025.01); H10D 30/031 (2025.01); H10D 30/6741 (2025.01); H10D 30/6743 (2025.01); H10D 30/675 (2025.01); H10D 30/6755 (2025.01); H10D 62/80 (2025.01); H10D 62/83 (2025.01); H10D 62/85 (2025.01); H10D 99/00 (2025.01)] | 16 Claims |

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1. A semiconductor device, comprising:
a substrate;
a channel region including a nanowire above the substrate;
a metallic source electrode and a metallic drain electrode above the substrate, wherein the metallic source electrode is laterally separated from a first end of the nanowire by a first semiconductor layer between the metallic source electrode and the nanowire, the first semiconductor layer having an uppermost surface co-planar with an uppermost surface of the metallic source electrode, and the metallic drain electrode is laterally separated from a second end of the nanowire by a second semiconductor layer between the metallic drain electrode and the nanowire, the second semiconductor layer having an uppermost surface co-planar with an uppermost surface of the metallic drain electrode;
a gate electrode over and around the nanowire, the gate electrode having a lateral width between the metallic source electrode and the metallic drain electrode that is greater than a lateral width of the nanowire between the metallic source electrode and the metallic drain electrode;
a first spacer above the substrate between the gate electrode and the metallic source electrode, a second spacer above the substrate between the gate electrode and the metallic drain electrode; and
a gate dielectric layer between the channel region and the gate electrode.
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