US 12,419,022 B2
Apparatus, system, and method of providing a circuit board carrier for an underfill system
Mark Tudman, St. Petersburg, FL (US); and Rayce Loftin, St. Petersburg, FL (US)
Assigned to JABIL INC.
Appl. No. 17/420,401
Filed by JABIL INC., St. Petersburg, FL (US)
PCT Filed Dec. 19, 2019, PCT No. PCT/US2019/067307
§ 371(c)(1), (2) Date Jul. 2, 2021,
PCT Pub. No. WO2020/142225, PCT Pub. Date Jul. 9, 2020.
Claims priority of provisional application 62/788,519, filed on Jan. 4, 2019.
Prior Publication US 2022/0087082 A1, Mar. 17, 2022
Int. Cl. H05K 13/00 (2006.01); H01L 21/683 (2006.01); H05B 1/02 (2006.01)
CPC H05K 13/0069 (2013.01) [H01L 21/683 (2013.01); H05B 1/023 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A carrier capable of supporting a printed circuit board during at least an underfill process, comprising:
an outer frame having, at least about a center point thereof, at least one open aspect;
at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board,
wherein the at least one frame inset comprises at least one heater and at least one air circulator for distributing heat from the at least one heater onto a bottom of the printed circuit board.