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1. A cooling plate for cooling microchips, comprising a thermally conductive plate assembly incorporating a first set of cooling channels and a second set of two-phase cooling channels, and further having an intake port for delivering cooling fluid to the first set of cooling channels and a return port for removing vapor from the first set of cooling channels, and wherein the second set of two-phase cooling channels is fluidly isolated from the first set of cooling channels such that the cooling fluid from the first set of cooling channels is prevented from flowing into the second set of two-phase cooling channels, wherein the first set of cooling channels and the second set of two-phase cooling channels form two different cooling channel circulations, wherein the first set of cooling channels circulation is operated as a main cooling and run continuously, and the second set of two-phase cooling channels circulation is operated as a backup, wherein the second set of two-phase cooling channels circulation is operated when the main cooling fails, wherein each of the second set of two-phase cooling channels comprises an evaporation chamber and evaporation condensation pipes attached to cooling lamellas, wherein the evaporation condensation pipes are inside the second set of two-phase cooling channels, wherein the cooling lamellas are inside the second set of two-phase cooling channels, wherein the cooling fluid in the evaporation chamber heats up, the cooling fluid vaporizes and rises in the evaporation condensation pipes, and the evaporation condensation pipes are cooled by the cooling lamellas, and wherein each of the second set of two-phase cooling channels comprises a wicking block to sustain the cooling fluid.
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