US 12,419,008 B2
Immersion cooling using cooling containers for an electronic device
Ching-Chun Hsu, Taipei (TW); Kai Zhang, Taipei (TW); Sung-Hsia Kuo, Taipei (TW); Hsin Chang Lu, Taipei (TW); and John R. Grady, Houston, TX (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Apr. 28, 2023, as Appl. No. 18/308,814.
Prior Publication US 2024/0365502 A1, Oct. 31, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20236 (2013.01) [H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H05K 7/20772 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a chassis having an internal volume configured to be partly filled with a coolant to form a coolant pool in the internal volume;
a plurality of electronic components disposed within the chassis;
a plurality of cooling containers disposed within the chassis such that each cooling container among the plurality of cooling containers contains at least one electronic component among the plurality of electronic components; and
a coolant loop configured to circulate the coolant from the coolant pool to the plurality of cooling containers,
wherein each cooling container among the plurality of cooling containers is configured to:
receive an inflow of the coolant from the coolant loop or from another one of the plurality of cooling containers and immerse the at least one electronic component in the coolant to remove heat from the at least one electronic component, and
output an outflow of the coolant that overflows into the coolant pool in the chassis or into at least one adjacent cooling container of the plurality of cooling containers,
wherein a level of the coolant in the coolant pool in the chassis is lower than respective levels of the coolant in the plurality of cooling containers.