US 12,418,984 B2
Wiring board and semiconductor device
Masahiro Murakami, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Sep. 27, 2022, as Appl. No. 17/935,634.
Claims priority of application No. 2021-163527 (JP), filed on Oct. 4, 2021.
Prior Publication US 2023/0106626 A1, Apr. 6, 2023
Int. Cl. H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/165 (2013.01) [H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 2201/086 (2013.01); H05K 2201/096 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wiring board comprising:
an interconnect structure including
a pad;
an insulating layer covering the pad and including a through hole defined by a wall of the insulating layer;
a magnetic resin disposed on the wall defining the through hole and on the pad inside the through hole; and
a via interconnect penetrating the magnetic resin and electrically connected to the pad inside the through hole, wherein:
the via interconnect makes contact with the magnetic resin inside the through hole, and
a top surface of the insulating layer coincides with a top surface of the magnetic resin.