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1. A laminated structure, comprising: an interconnect substrate having a first surface and a second surface opposite to the first surface; an insulating encapsulant laterally wrapping the interconnect substrate; and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate, wherein the redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface, the redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads, wherein the first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with and fully cover outer sidewalls and top surfaces of the pad portions of the first pads, wherein at least one protective pattern extends beyond the below first pad and extends along and contacts the fourth surface with a lateral distance.
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