US 12,417,961 B2
Chip heat sink and nucleic acid extraction device
Beiyuan Fan, Beijing (CN); and Ding Ding, Beijing (CN)
Assigned to Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 18/016,411
Filed by Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Jan. 28, 2022, PCT No. PCT/CN2022/074515
§ 371(c)(1), (2) Date Jan. 16, 2023,
PCT Pub. No. WO2023/141916, PCT Pub. Date Aug. 3, 2023.
Prior Publication US 2024/0249997 A1, Jul. 25, 2024
Int. Cl. H01L 23/00 (2006.01); B01L 3/00 (2006.01); H01L 23/46 (2006.01)
CPC H01L 23/46 (2013.01) [B01L 3/502761 (2013.01); B01L 2300/1811 (2013.01); B01L 2300/1838 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip heat sink for a chip, wherein the chip has a channel for conveying a fluid, and on/off of the channel is controlled by a solenoid valve, and the chip heat sink comprises:
a substrate, wherein the substrate has a first surface for placing the chip, and the first surface is provided with a first accommodating groove for accommodating an electromagnet; and
a heat dissipation structure on the substrate and for dissipating heat from the electromagnet.