US 12,417,939 B2
Semiconductor device and method of detecting semiconductor wafer centered on tape
Tack Chee Yong, Singapore (SG); Yi Jing Eric Chong, Singapore (SG); Kok Lim Jason Ng, Singapore (SG); and Linda Pei Ee Chua, Singapore (SG)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Oct. 2, 2023, as Appl. No. 18/479,276.
Prior Publication US 2025/0112078 A1, Apr. 3, 2025
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/6836 (2013.01) [H01L 21/67259 (2013.01); H01L 21/681 (2013.01); H01L 2221/68309 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing equipment, comprising:
a wafer tape configured to receive a semiconductor wafer thereon, the wafer tape including a plurality of alignment holes formed through the wafer tape;
and
a light source disposed under the wafer tape,
wherein the plurality of alignment holes and the light source are spatially arranged and configured to indicate a misaligned position of the semiconductor wafer on the wafer tape with light passing through one or more alignment holes.