US 12,416,869 B2
Image device and motherboard for image device
Tomoki Yokota, Suwa (JP); and Kikuya Morita, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Apr. 28, 2022, as Appl. No. 17/732,503.
Claims priority of application No. 2021-077279 (JP), filed on Apr. 30, 2021.
Prior Publication US 2022/0350267 A1, Nov. 3, 2022
Int. Cl. G03F 9/00 (2006.01); G02B 5/28 (2006.01); H05K 13/00 (2006.01)
CPC G03F 9/7076 (2013.01) [G02B 5/285 (2013.01); G03F 9/708 (2013.01); H05K 13/0015 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An image device comprising:
a substrate body; and
a mark including:
a recessed portion provided in the substrate body and
a filling film filled in the recessed portion, wherein
the recessed portion includes:
a first groove extending along a first direction and
a second groove extending along a second direction intersecting with the first direction, the second groove disconnected from the first groove in a plan view,
wherein
a pixel electrode for applying a voltage to an electro-optical layer, a light-emitting element, a mirror, or a photoreceptor element is provided in a pixel.