US 12,416,092 B2
Plating apparatus
Masaki Tomita, Tokyo (JP); and Yasuyuki Masuda, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/792,079
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Oct. 28, 2021, PCT No. PCT/JP2021/039789
§ 371(c)(1), (2) Date Jul. 11, 2022,
PCT Pub. No. WO2023/073860, PCT Pub. Date May 4, 2023.
Prior Publication US 2024/0175165 A1, May 30, 2024
Int. Cl. C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/04 (2006.01); C25D 21/12 (2006.01)
CPC C25D 17/002 (2013.01) [C25D 17/001 (2013.01); C25D 17/06 (2013.01); C25D 21/04 (2013.01); C25D 21/12 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank having a bottom wall and an outer peripheral wall extending upward from an outer edge of the bottom wall, the plating tank being configured to accumulate a plating solution and have an anode arranged therein;
a substrate holder arranged above the anode, the substrate holder being configured to hold a substrate as a cathode such that the substrate is opposed to the anode; and
a membrane module arranged above the anode and below the substrate, wherein
the membrane module includes a first membrane configured to partition an inside of the plating tank into an anode chamber and a cathode chamber below the anode chamber, and a second membrane arranged at a position below the first membrane and above the anode without contacting the first membrane, and
the second membrane has an inflow port for causing a plating solution in a first region below the second membrane to flow into a second region above the second membrane and below the first membrane, and an inclined portion inclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of the anode chamber to an outer edge side of the anode chamber.