US 12,415,719 B2
MEMS sensor with particle filter and method for producing it
Andre Brockmeier, Villach (AT); Barbara Angela Glanzer, Klagenfurt (AT); Marten Oldsen, Anzing (DE); Francesco Solazzi, Villach (AT); and Carsten Von Koblinski, Villach (AT)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jul. 15, 2021, as Appl. No. 17/376,539.
Claims priority of application No. 102020120370.5 (DE), filed on Aug. 3, 2020.
Prior Publication US 2022/0033249 A1, Feb. 3, 2022
Int. Cl. B81B 7/00 (2006.01); B81B 3/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); G01L 19/06 (2006.01); H04R 1/04 (2006.01)
CPC B81B 7/0032 (2013.01) [B81B 3/0021 (2013.01); B81B 7/0041 (2013.01); B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81B 7/007 (2013.01); B81B 7/0074 (2013.01); B81B 7/02 (2013.01); B81C 1/00293 (2013.01); B81C 1/00357 (2013.01); G01L 9/0042 (2013.01); G01L 19/0636 (2013.01); G01L 19/0654 (2013.01); H04R 1/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81C 2201/0133 (2013.01); H04R 2201/003 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface;
a first glass-based substrate, on which the first main surface of the MEMS chip is arranged, wherein the first glass-based substrate includes a plurality of perforation holes;
a second substrate which is arranged on the second main surface of the MEMS chip,
wherein the first main surface of the MEMS chip has a first recess connected to an external environment by way of the plurality of perforation holes that extend through the first glass-based substrate between the first recess and the external environment,
wherein the second substrate has a second recess that is situated opposite the first recess of the MEMS chip and forms a back volume for the MEMS chip,
wherein the MEMS chip has a membrane situated between the first recess and the second recess,
wherein the first glass-based substrate includes a first through connection that extends through the first glass-based substrate,
wherein the MEMS chip has a second through connection that extends through the MEMS chip, in alignment with the first through connection; and
a metallization that extends from the second main surface of the MEMS chip, through the first through connection, and through the second through connection.