US 12,089,436 B2
Encapsulation film having moisture adsorbent and metal mesh layer
Jae Seol Ryu, Daejeon (KR); Dong Hwan Ryu, Daejeon (KR); Moon Cheol Shin, Daejeon (KR); Se Hyun Jang, Daejeon (KR); and Yeong Bong Mok, Daejeon (KR)
Assigned to LG Chem, Ltd., Seoul (KR)
Appl. No. 17/268,899
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Aug. 16, 2019, PCT No. PCT/KR2019/010434
§ 371(c)(1), (2) Date Feb. 16, 2021,
PCT Pub. No. WO2020/036462, PCT Pub. Date Feb. 20, 2020.
Claims priority of application No. 10-2018-0095580 (KR), filed on Aug. 16, 2018.
Prior Publication US 2021/0328190 A1, Oct. 21, 2021
Int. Cl. H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 71/00 (2023.01)
CPC H10K 50/846 (2023.02) [H10K 50/844 (2023.02); H10K 71/00 (2023.02)] 19 Claims
OG exemplary drawing
 
1. An encapsulation film for an organic electronic element, comprising:
an encapsulation layer comprising a moisture adsorbent; and
a metal mesh layer formed on the encapsulation layer,
wherein the metal mesh layer comprises a metal pattern having a line width in a range of 1 to 50 mm.