US 12,089,384 B2
Electronic device
Hojong Kim, Suwon-si (KR); Changhwan Jin, Suwon-si (KR); Jonghun Choi, Suwon-si (KR); Byungchul Lee, Suwon-si (KR); Jaeyoung Huh, Suwon-si (KR); Hyunchul Hong, Suwon-si (KR); and Jaeuk Ryu, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Appl. No. 17/436,357
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
PCT Filed Aug. 10, 2021, PCT No. PCT/KR2021/010539
§ 371(c)(1), (2) Date Sep. 3, 2021,
PCT Pub. No. WO2022/035171, PCT Pub. Date Feb. 17, 2022.
Claims priority of application No. 10-2020-0100600 (KR), filed on Aug. 11, 2020.
Prior Publication US 2022/0330463 A1, Oct. 13, 2022
Int. Cl. G01R 15/04 (2006.01); G01R 19/10 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01)
CPC H05K 9/0028 (2013.01) [G01R 15/04 (2013.01); G01R 19/10 (2013.01); H05K 1/0216 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a substrate;
a first electronic component mounted on a first region of a surface of the substrate;
a second electronic component mounted on a second region of the surface of the substrate;
a first electromagnetic interference (EMI) shield configured to shield the first electronic component; and
a second EMI shield configured to shield the second electronic component,
wherein the first EMI shield includes a first shield cover and a first shield frame configured to surround the first electronic component between the first shield cover and the first region,
wherein the second EMI shield includes a second shield cover and a second shield frame, and
wherein the second shield frame and a portion of the first shield frame are configured to surround the second electronic component between the second shield cover and the second region.