US 12,089,376 B2
Heat dissipation device and server including a fixing bracket and heat sinks
Guidong Song, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jun. 24, 2022, as Appl. No. 17/848,520.
Application 17/848,520 is a continuation of application No. PCT/CN2020/120201, filed on Oct. 10, 2020.
Claims priority of application No. 201911378498.4 (CN), filed on Dec. 27, 2019.
Prior Publication US 2022/0322566 A1, Oct. 6, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20772 (2013.01) [H05K 7/2049 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising a fixing bracket and a plurality of heat sinks, wherein
the fixing bracket comprises a mounting part, and a plurality of first mounting holes are provided on the mounting part; and
a fixing part is disposed on each of the plurality of heat sinks, and the fixing parts disposed on the plurality of heat sinks are inserted into the plurality of first mounting holes,
wherein, for each of the fixed parts, the fixed part is disposed on its corresponding heat sink and inserted into its corresponding first mounting hole, a height of the fixing part above a surface of the corresponding heat sink along a direction perpendicular to the corresponding heat sink is greater than a thickness of the fixing bracket, the fixing part fits a gap of the corresponding first mounting hole, and a difference between the height of the fixing part above the surface of the corresponding heat sink along the direction perpendicular to the corresponding heat sink and a thickness of the mounting part is in a range from 1 mm to 2 mm.