US 12,089,367 B2
Liquid-cooling plate for CPU
Jiangjun Wu, Shanghai (CN); Pinyi Xiang, Shanghai (CN); and Ke Sun, Shanghai (CN)
Assigned to INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed by INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed on Jun. 17, 2022, as Appl. No. 17/843,792.
Claims priority of application No. 202210249323.9 (CN), filed on Mar. 14, 2022.
Prior Publication US 2023/0292461 A1, Sep. 14, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 7/20272 (2013.01); H05K 7/20809 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A liquid-cooling plate for a CPU, comprising a circulating liquid-cooling main body, a peripheral frame, a base and at least one liquid accumulation reservoir, the base having a central portion and a peripheral portion surrounding the central portion, the peripheral frame disposed on the peripheral portion so that the central portion is exposed from the peripheral frame, the central portion and the peripheral portion forming a step therebetween so that the central portion is raised over the peripheral portion, the central portion defining an interior space and having a cover and two faucets, the interior space configured to accommodate the circulating liquid-cooling main body, the cover closing the interior space, the two faucets located above the cover and communicating with the circulating liquid-cooling main body, the at least one liquid accumulation reservoir located external to the central portion and configured to contain a liquid leaked from at least one of the two faucets;
wherein a height difference is formed between a top surface of the cover and a top surface of the central portion, and the top surface of the cover is lower than the top surface of the central portion.