US 12,089,349 B2
Semiconductor device package and method of manufacturing the same
Ming-Hung Chen, Kaohsiung (TW); Yung I Yeh, Kaohsiung (TW); Chang-Lin Yeh, Kaohsiung (TW); and Sheng-Yu Chen, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Koahsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 29, 2023, as Appl. No. 18/239,723.
Application 18/239,723 is a continuation of application No. 17/573,595, filed on Jan. 11, 2022, granted, now 11,744,024.
Application 17/573,595 is a continuation of application No. 16/563,713, filed on Sep. 6, 2019, granted, now 11,224,132, issued on Jan. 11, 2022.
Prior Publication US 2023/0413454 A1, Dec. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 5/00 (2006.01); H05K 5/06 (2006.01); H05K 9/00 (2006.01)
CPC H05K 5/0017 (2013.01) [H05K 1/142 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 5/065 (2013.01); H05K 9/0022 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a circuit;
a first reinforced structure disposed adjacent to the circuit;
a sensor connected to the circuit;
a second reinforced structure, wherein the circuit is disposed between the first reinforced structure and the second reinforced structure, and wherein the sensor is exposed from the second reinforced structure; and
an encapsulation layer covering the first reinforced structure and the second reinforced structure; the encapsulation layer has a curved surface.