US 12,089,342 B2
Insulated circuit board
Akira Sakurai, Saitama (JP); and Nobuyuki Terasaki, Saitama (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/793,721
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Mar. 16, 2021, PCT No. PCT/JP2021/010548
§ 371(c)(1), (2) Date Jul. 19, 2022,
PCT Pub. No. WO2021/187464, PCT Pub. Date Sep. 23, 2021.
Claims priority of application No. 2020-047956 (JP), filed on Mar. 18, 2020; and application No. 2021-040435 (JP), filed on Mar. 12, 2021.
Prior Publication US 2023/0091454 A1, Mar. 23, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/00 (2006.01)
CPC H05K 3/0061 (2013.01) [H05K 1/0204 (2013.01); H05K 2201/032 (2013.01); H05K 2203/1194 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An insulating circuit substrate in which an aluminum sheet formed of aluminum or an aluminum alloy is laminated and bonded to a surface of a ceramic substrate,
wherein, in the aluminum sheet, Cu is solid-solubilized at a bonding interface with the ceramic substrate, and a ratio B/A between a Cu concentration A mass % at the bonding interface and a Cu concentration B mass % at a position of 100 μm in a thickness direction from the bonding interface to the aluminum sheet side is 0.30 or more and 0.85 or less.