US 12,089,340 B2
Electronic component mounting device for mounting electronic components at certain intervals
Hiroshi Aoyama, Akashi (JP); and Toru Hayashida, Akashi (JP)
Assigned to HALLYS CORPORATION, Akashi (JP)
Appl. No. 17/612,933
Filed by HALLYS CORPORATION, Akashi (JP)
PCT Filed May 18, 2020, PCT No. PCT/JP2020/019679
§ 371(c)(1), (2) Date Nov. 19, 2021,
PCT Pub. No. WO2020/235535, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 2019-095593 (JP), filed on May 21, 2019.
Prior Publication US 2022/0232745 A1, Jul. 21, 2022
Int. Cl. H05K 13/04 (2006.01); H05K 13/00 (2006.01)
CPC H05K 13/0482 (2013.01) [H05K 13/0053 (2013.01); H05K 13/0409 (2018.08); H05K 13/041 (2018.08)] 21 Claims
OG exemplary drawing
 
1. An electronic component mounting device configured to mount, on attachments, a plurality of electronic components that have been placed at intervals in a predetermined portion such that the plurality of the electronic components are placed on the attachments at certain intervals that are different from each other and are different from the intervals in the predetermined portion, the electronic component mounting device comprising:
a removal mechanism configured to remove some of the plurality of the electronic components that have been placed in the predetermined portion;
a transport mechanism configured to transport the electronic components that have been removed by the removal mechanism, configured to move the electronic components such that, before reaching the attachments, the plurality of the electronic components are arranged at the certain intervals at which the plurality of the electronic components are to be mounted on the attachments, and configured to transport the electronic components to the attachments; and
a mounting and transfer mechanism configured to mount the electronic components that have been transported by the transport mechanism on predetermined positions of the attachments, wherein
the transport mechanism comprises:
an alignment portion in which the electronic components are positioned, between the removal mechanism and the mounting and transfer mechanism, in a plurality of columns comprising the certain intervals therebetween;
a first transfer mechanism configured to hold the electronic components removed by the removal mechanism and configured to move the electronic components that has been held to the alignment portion; and
a second transfer mechanism configured to transfer the electronic components that have been moved to the alignment portion to the mounting and transfer mechanism,
the first transfer mechanism comprises a sucking and holding device that is configured to change a number of electronic components to be sucked,
the sucking and holding device comprises:
a suction tool comprising a plurality of suction ports and a degassing port; and
a displacement body which is displaced relative to the suction tool to allow the plurality of the suction ports and the degassing port to communicate with each other, and
the displacement body is configured to selectively change a communication state between a part or all of the plurality of the suction ports and the degassing port, depending on a position relative to the suction tool.