| CPC H05K 1/183 (2013.01) [H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 2201/09036 (2013.01)] | 17 Claims |
|
1. A circuit board comprising:
a core portion including a first cavity disposed in one surface, and a second cavity disposed in the other surface opposing the one surface and having a diameter different from a diameter of the first cavity;
first and second electronic components respectively disposed in the first and second cavities of the core portion;
first and second insulating materials respectively disposed on the one surface and the other surface of the core portion to bury the core portion and the first and second electronic components;
a first metal layer disposed on the one surface of the core portion;
a second metal layer buried in the core portion, wherein at least a portion of the second metal layer extends from the first cavity of the core portion and to the second cavity of the core portion;
a via connecting the first and second metal layers to each other, wherein the via overlaps the second cavity of the core portion along a thickness direction of the circuit board; and
a third metal layer disposed on the other surface of the core portion.
|