US 12,089,329 B2
Printed circuit board comprising via portions
Sung Wuk Ryu, Seoul (KR); Seung Yul Shin, Seoul (KR); and Joon Wook Han, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/756,958
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Nov. 27, 2020, PCT No. PCT/KR2020/017090
§ 371(c)(1), (2) Date Jun. 6, 2022,
PCT Pub. No. WO2021/112499, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 10-2019-0159974 (KR), filed on Dec. 4, 2019; and application No. 10-2019-0159997 (KR), filed on Dec. 4, 2019.
Prior Publication US 2022/0418106 A1, Dec. 29, 2022
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/112 (2013.01) [H05K 1/0298 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/096 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating layer;
a second insulating layer disposed on an upper surface of the first insulating layer;
a first via portion disposed in the first insulating layer;
a circuit pattern disposed on the upper surface of the first insulating layer and connected to the first via portion, and
a second via portion disposed in the second insulating layer;
wherein the first via portion includes:
a first via part passing through the upper surface and a lower surface of the first insulating layer; and
a first-first pad disposed on an upper surface of the first via part;
wherein the second via portion includes:
a second via part passing through upper and lower surfaces of the second insulating layer;
a second pad disposed on upper surface of the second via part;
wherein a width of the first-first pad is smaller than a width of the upper surface of the first via part and a width of the lower surface of the second via part;
wherein a side surface of the first-first pad is covered by the second via part; and
wherein the first circuit pattern is connected to the first-first pad.