US 12,088,945 B2
Imaging device and electronic equipment
Luonghung Asakura, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed on Sep. 27, 2023, as Appl. No. 18/475,662.
Application 18/475,662 is a continuation of application No. 17/281,412, granted, now 11,832,011, previously published as PCT/JP2019/036091, filed on Sep. 13, 2019.
Claims priority of application No. 2018-209460 (JP), filed on Nov. 7, 2018.
Prior Publication US 2024/0040285 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 25/772 (2023.01); H01L 27/146 (2006.01); H04N 25/75 (2023.01)
CPC H04N 25/772 (2023.01) [H01L 27/14612 (2013.01); H01L 27/14634 (2013.01); H01L 27/14643 (2013.01); H04N 25/75 (2023.01)] 14 Claims
OG exemplary drawing
 
1. An imaging device comprising:
a first substrate including a pixel array comprising pixels that respectively include light receiving portions; and
a second substrate in which a circuit is formed and on which the first substrate is stacked, wherein
the pixel array is divided into pixel blocks in units of pixel columns or pixel rows,
the first substrate includes a fault detection circuit configured to perform detection of a wiring fault for each of the pixel blocks, and
the fault detection circuit is configured to, during a wiring fault detection time, connect a plurality of wiring lines corresponding to a plurality of the pixel columns or a plurality of the pixel rows in series for each of the pixel blocks.