US 12,088,253 B2
Circuit board and oscillator device
Koichi Mizugaki, Suwa (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 9, 2023, as Appl. No. 18/181,094.
Claims priority of application No. 2022-037855 (JP), filed on Mar. 11, 2022.
Prior Publication US 2023/0291353 A1, Sep. 14, 2023
Int. Cl. H03B 5/32 (2006.01); H03B 1/02 (2006.01); H03B 5/04 (2006.01); H03L 1/02 (2006.01); H03L 1/04 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H10N 30/88 (2023.01)
CPC H03B 5/32 (2013.01) [H03B 1/02 (2013.01); H03B 5/04 (2013.01); H03L 1/028 (2013.01); H03L 1/04 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H10N 30/88 (2023.02); H05K 2201/10083 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a semiconductor substrate including a first surface and a second surface located at an opposite side from the first surface;
a circuit provided at a first surface side;
a first external electrode provided at a second surface side;
a heater provided at the second surface side; and
a plurality of through electrodes penetrating the first surface and the second surface and electrically coupling the circuit and the first external electrode or the heater, wherein
the heater and the first external electrode do not overlap each other in a plan view.