US 12,087,895 B2
Image display device manufacturing method and image display device
Hajime Akimoto, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Nov. 9, 2021, as Appl. No. 17/522,394.
Application 17/522,394 is a continuation of application No. PCT/JP2020/018397, filed on May 1, 2020.
Claims priority of application No. 2019-089679 (JP), filed on May 10, 2019.
Prior Publication US 2022/0069187 A1, Mar. 3, 2022
Int. Cl. H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/42 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/32 (2013.01); H01L 33/42 (2013.01); H01L 33/50 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for manufacturing an image display device, the method comprising:
providing a semiconductor growth substrate comprising a semiconductor layer on a first substrate, the semiconductor layer comprising a light-emitting layer;
forming a first insulating film on a second substrate, wherein the second substrate comprises a circuit, and the circuit comprises a circuit element and a first wiring layer;
forming a plug in the first insulating film, the plug being connected with the circuit element;
bonding the semiconductor layer to the second substrate and electrically connecting the plug to the semiconductor layer;
forming a light-emitting element by patterning the semiconductor layer, the light-emitting element being electrically connected to the plug;
forming a second insulating film covering the light-emitting element and the first insulating film;
exposing a portion of the light-emitting element by removing a portion of the second insulating film; and
forming a second wiring layer on the second insulating film.