US 12,087,886 B2
Header for semiconductor package, and semiconductor package
Wataru Katayama, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Nov. 9, 2021, as Appl. No. 17/454,100.
Claims priority of application No. 2020-204085 (JP), filed on Dec. 9, 2020.
Prior Publication US 2022/0181525 A1, Jun. 9, 2022
Int. Cl. H01L 33/48 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/486 (2013.01) [H01L 33/62 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A header for a semiconductor package, comprising:
an eyelet having a first surface, a second surface opposite to the first surface, and a through hole penetrating the eyelet from the first surface to the second surface; and
a metal block having a pedestal, and a columnar part protruding from the pedestal, wherein
the pedestal is inserted into the through hole, so that a portion of the columnar part protrudes from the first surface,
the columnar part includes a device mounting surface on which a semiconductor device is mounted,
an outer periphery of the pedestal is exposed around the columnar part in a plan view,
the pedestal has a generally rectangular shape in the plan view,
corners at both ends of a first side of the pedestal at the device mounting surface are rounded, and
corners at both ends of a second side of the pedestal, opposing the first side, are rounded with a radius larger than that of the corners at both ends of the first side.