US 12,087,804 B2
Light emitting device
Chung Hoon Lee, Ansan-si (KR)
Assigned to SEOUL VIOSYS CO., LTD., Ansan-si (KR)
Filed by SEOUL VIOSYS CO., LTD., Ansan-si (KR)
Filed on Sep. 10, 2021, as Appl. No. 17/471,836.
Application 17/471,836 is a continuation of application No. 16/670,293, filed on Oct. 31, 2019, granted, now 11,158,665.
Claims priority of provisional application 62/755,652, filed on Nov. 5, 2018.
Prior Publication US 2021/0408101 A1, Dec. 30, 2021
Int. Cl. H01L 27/15 (2006.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01)
CPC H01L 27/15 (2013.01) [H01L 33/382 (2013.01); H01L 33/44 (2013.01); H01L 33/505 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a substrate having a first region and a second region;
a light emitting stack including vertically stacked semiconductor layers disposed on the first region of the substrate;
at least one pillar including a region disposed on the second region of the substrate and laterally spaced apart from the light emitting stack;
at least one electrode extending from the first region to the second region of the substrate and electrically connecting the light emitting stack to the at least one pillar; and
a passivation layer covering the light emitting stack and the substrate; and
a plurality of pads electrically connected to the at least one pillar, respectively wherein the at least one pillar is connected to the at least one electrode, respectively, and
wherein the passivation layer comprises at least one epoxy resin, epoxy molding compound, or silicone.