US 12,087,785 B2
Image sensor and manufacturing process thereof
Hoemin Jeong, Suwon-si (KR); Seungjoo Nah, Gwangju (KR); Heegeun Jeong, Suwon-si (KR); and Wonmo Chun, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 1, 2021, as Appl. No. 17/453,013.
Claims priority of application No. 10-2020-0159232 (KR), filed on Nov. 24, 2020.
Prior Publication US 2022/0165766 A1, May 26, 2022
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14605 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/1463 (2013.01); H01L 27/14634 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor comprising:
a substrate including a plurality of first pixels configured to generate image data and a plurality of second pixels configured to detect phase information of light incident to the plurality of second pixels;
a light blocking pattern disposed on the substrate and providing a plurality of spaces, the plurality of spaces including a plurality of first spaces respectively disposed on the first pixels and at least one second space disposed on the plurality of second pixels;
a plurality of color filters respectively disposed in the plurality of first spaces; and
a microlens layer including a plurality of first microlenses respectively disposed on the plurality of color filters, at least one filling portion disposed in the at least one second space, and at least one second microlens disposed on the at least one filling portion,
wherein the plurality of first microlenses and the at least one second microlens are disposed at the same height as each other, and
wherein the at least one filling portion and the at least one second microlens comprise an integrated structure without an interface between the at least one filling portion and the at least one second microlens.